<b>plastic thin shrink small outline package; 14 leads; body width 4.4 mm</b><p> SOT402-1<br> Source: http://www.nxp.com/documents/data_sheet/74ABT125.pdf >NAME >VALUE >NAME >VALUE WR-FPC-0.50mm SMT ZIF Vertical Type A,pins 16 1 >NAME >VALUE 16 1 >NAME >VALUE 20-QFN, 0.50 mm pitch, 4.00 X 4.00 X 0.90 mm body, 2.60 X 2.60 mm thermal pad <p>20-pin QFN package with 0.50 mm pitch with body size 4.00 X 4.00 X 0.90 mm and thermal pad size 2.60 X 2.60 mm</p> >NAME >VALUE 14-QFN, 0.50 mm pitch, 3.00 X 3.00 X 1.00 mm body, 1.65 X 2.40 mm thermal pad <p>14-pin QFN package with 0.50 mm pitch with body size 3.00 X 3.00 X 1.00 mm and thermal pad size 1.65 X 2.40 mm</p> >NAME >VALUE 5-SOT23, 0.65 mm pitch, 2.15 mm span, 2.15 X 1.30 X 1.10 mm body <p>5-pin SOT23 package with 0.65 mm pitch, 2.15 mm span with body size 2.15 X 1.30 X 1.10 mm</p> >NAME >VALUE 56-QFN, 0.50 mm pitch, 8.00 X 8.00 X 1.00 mm body, 6.00 X 6.00 mm thermal pad <p>56-pin QFN package with 0.50 mm pitch with body size 8.00 X 8.00 X 1.00 mm and thermal pad size 6.00 X 6.00 mm</p> >NAME >VALUE <b>48-pin plastic LQFP (FPT-48P-M26)</b><p> www.fma.fujitsu.com/pdf/e713717.pdf >NAME >VALUE Oscillator Corner Concave, 6.50 X 4.00 X 1.20 mm body <p>Oscillator Corner Concave package with body size 6.50 X 4.00 X 1.20 mm</p> >NAME >VALUE DFN3, 1.00 X 0.60 X 0.40 mm body <p>DFN3 package with body size 1.00 X 0.60 X 0.40 mm</p> >NAME >VALUE >NAME >VALUE <b>RESISTOR</b><p> >NAME >VALUE <b>Chip RESISTOR 0402 EIA (1005 Metric)</b> >NAME >VALUE <b> <br><b>WE-TPC SMD Tiny Power Inductorr<br></b> <pre> <b><font size="4">Size: </b>3816 >VALUE >NAME plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1 Source: http://www.nxp.com/documents/data_sheet/74ABT125.pdf 8-SOP, 0.50 mm pitch, 3.10 mm span, 2.00 X 2.30 X 0.90 mm body <p>8-pin SOP package with 0.50 mm pitch, 3.10 mm span with body size 2.00 X 2.30 X 0.90 mm</p> 20-QFN, 0.50 mm pitch, 4.00 X 4.00 X 0.90 mm body, 2.60 X 2.60 mm thermal pad <p>20-pin QFN package with 0.50 mm pitch with body size 4.00 X 4.00 X 0.90 mm and thermal pad size 2.60 X 2.60 mm</p> 14-QFN, 0.50 mm pitch, 3.00 X 3.00 X 1.00 mm body, 1.65 X 2.40 mm thermal pad <p>14-pin QFN package with 0.50 mm pitch with body size 3.00 X 3.00 X 1.00 mm and thermal pad size 1.65 X 2.40 mm</p> 5-SOT23, 0.65 mm pitch, 2.15 mm span, 2.15 X 1.30 X 1.10 mm body <p>5-pin SOT23 package with 0.65 mm pitch, 2.15 mm span with body size 2.15 X 1.30 X 1.10 mm</p> 56-QFN, 0.50 mm pitch, 8.00 X 8.00 X 1.00 mm body, 6.00 X 6.00 mm thermal pad <p>56-pin QFN package with 0.50 mm pitch with body size 8.00 X 8.00 X 1.00 mm and thermal pad size 6.00 X 6.00 mm</p> 48-pin plastic LQFP (FPT-48P-M26) www.fma.fujitsu.com/pdf/e713717.pdf Oscillator Corner Concave, 6.50 X 4.00 X 1.20 mm body <p>Oscillator Corner Concave package with body size 6.50 X 4.00 X 1.20 mm</p> DFN3, 1.00 X 0.60 X 0.40 mm body <p>DFN3 package with body size 1.00 X 0.60 X 0.40 mm</p> IN NC COM NO >Name IN NO COM >Name VCC GND >Name >Value >Name >Name >NAME >VALUE Boom Temp 1k Boom Hygro 1k >Name >NAME >VALUE GND >Name >Value >Name >Value >Name >Value >Name >Value >Name >Value >Name >Value >Name >Value >Name >Name >Name >Value >VALUE >VALUE >VALUE >VALUE >Name >Value >Name >Value >Name >Value VCC OUT GND >name >value >name >value >name >value >name >value >NAME >VALUE >NAME >VALUE 3 input logic NOR gate >NAME >VALUE <b>SUPPLY SYMBOL</b> <b>SUPPLY SYMBOL</b> <b>SUPPLY SYMBOL</b> <b>SUPPLY SYMBOL</b> Since Version 6.2.2 text objects can contain more than one line, which will not be processed correctly with this version. Since Version 8.3, EAGLE supports URNs for individual library assets (packages, symbols, and devices). The URNs of those assets will not be understood (or retained) with this version. Since Version 8.3, EAGLE supports the association of 3D packages with devices in libraries, schematics, and board files. Those 3D packages will not be understood (or retained) with this version.