<b>plastic thin shrink small outline package; 14 leads; body width 4.4 mm</b><p>
SOT402-1<br>
Source: http://www.nxp.com/documents/data_sheet/74ABT125.pdf
>NAME
>VALUE
>NAME
>VALUE
WR-FPC-0.50mm SMT ZIF Vertical Type A,pins 16
1
>NAME
>VALUE
16
1
>NAME
>VALUE
20-QFN, 0.50 mm pitch, 4.00 X 4.00 X 0.90 mm body, 2.60 X 2.60 mm thermal pad
<p>20-pin QFN package with 0.50 mm pitch with body size 4.00 X 4.00 X 0.90 mm and thermal pad size 2.60 X 2.60 mm</p>
>NAME
>VALUE
14-QFN, 0.50 mm pitch, 3.00 X 3.00 X 1.00 mm body, 1.65 X 2.40 mm thermal pad
<p>14-pin QFN package with 0.50 mm pitch with body size 3.00 X 3.00 X 1.00 mm and thermal pad size 1.65 X 2.40 mm</p>
>NAME
>VALUE
5-SOT23, 0.65 mm pitch, 2.15 mm span, 2.15 X 1.30 X 1.10 mm body
<p>5-pin SOT23 package with 0.65 mm pitch, 2.15 mm span with body size 2.15 X 1.30 X 1.10 mm</p>
>NAME
>VALUE
56-QFN, 0.50 mm pitch, 8.00 X 8.00 X 1.00 mm body, 6.00 X 6.00 mm thermal pad
<p>56-pin QFN package with 0.50 mm pitch with body size 8.00 X 8.00 X 1.00 mm and thermal pad size 6.00 X 6.00 mm</p>
>NAME
>VALUE
<b>48-pin plastic LQFP (FPT-48P-M26)</b><p>
www.fma.fujitsu.com/pdf/e713717.pdf
>NAME
>VALUE
Oscillator Corner Concave, 6.50 X 4.00 X 1.20 mm body
<p>Oscillator Corner Concave package with body size 6.50 X 4.00 X 1.20 mm</p>
>NAME
>VALUE
DFN3, 1.00 X 0.60 X 0.40 mm body
<p>DFN3 package with body size 1.00 X 0.60 X 0.40 mm</p>
>NAME
>VALUE
>NAME
>VALUE
<b>RESISTOR</b><p>
>NAME
>VALUE
<b>Chip RESISTOR 0402 EIA (1005 Metric)</b>
>NAME
>VALUE
<b> <br><b>WE-TPC SMD Tiny Power Inductorr<br></b>
<pre> <b><font size="4">Size: </b>3816
>VALUE
>NAME
plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
Source: http://www.nxp.com/documents/data_sheet/74ABT125.pdf
8-SOP, 0.50 mm pitch, 3.10 mm span, 2.00 X 2.30 X 0.90 mm body
<p>8-pin SOP package with 0.50 mm pitch, 3.10 mm span with body size 2.00 X 2.30 X 0.90 mm</p>
20-QFN, 0.50 mm pitch, 4.00 X 4.00 X 0.90 mm body, 2.60 X 2.60 mm thermal pad
<p>20-pin QFN package with 0.50 mm pitch with body size 4.00 X 4.00 X 0.90 mm and thermal pad size 2.60 X 2.60 mm</p>
14-QFN, 0.50 mm pitch, 3.00 X 3.00 X 1.00 mm body, 1.65 X 2.40 mm thermal pad
<p>14-pin QFN package with 0.50 mm pitch with body size 3.00 X 3.00 X 1.00 mm and thermal pad size 1.65 X 2.40 mm</p>
5-SOT23, 0.65 mm pitch, 2.15 mm span, 2.15 X 1.30 X 1.10 mm body
<p>5-pin SOT23 package with 0.65 mm pitch, 2.15 mm span with body size 2.15 X 1.30 X 1.10 mm</p>
56-QFN, 0.50 mm pitch, 8.00 X 8.00 X 1.00 mm body, 6.00 X 6.00 mm thermal pad
<p>56-pin QFN package with 0.50 mm pitch with body size 8.00 X 8.00 X 1.00 mm and thermal pad size 6.00 X 6.00 mm</p>
48-pin plastic LQFP (FPT-48P-M26)
www.fma.fujitsu.com/pdf/e713717.pdf
Oscillator Corner Concave, 6.50 X 4.00 X 1.20 mm body
<p>Oscillator Corner Concave package with body size 6.50 X 4.00 X 1.20 mm</p>
DFN3, 1.00 X 0.60 X 0.40 mm body
<p>DFN3 package with body size 1.00 X 0.60 X 0.40 mm</p>
IN
NC
COM
NO
>Name
IN
NO
COM
>Name
VCC
GND
>Name
>Value
>Name
>Name
>NAME
>VALUE
Boom Temp
1k
Boom Hygro
1k
>Name
>NAME
>VALUE
GND
>Name
>Value
>Name
>Value
>Name
>Value
>Name
>Value
>Name
>Value
>Name
>Value
>Name
>Value
>Name
>Name
>Name
>Value
>VALUE
>VALUE
>VALUE
>VALUE
>Name
>Value
>Name
>Value
>Name
>Value
VCC
OUT
GND
>name
>value
>name
>value
>name
>value
>name
>value
>NAME
>VALUE
>NAME
>VALUE
3 input logic NOR gate
>NAME
>VALUE
<b>SUPPLY SYMBOL</b>
<b>SUPPLY SYMBOL</b>
<b>SUPPLY SYMBOL</b>
<b>SUPPLY SYMBOL</b>
Since Version 6.2.2 text objects can contain more than one line,
which will not be processed correctly with this version.
Since Version 8.3, EAGLE supports URNs for individual library
assets (packages, symbols, and devices). The URNs of those assets
will not be understood (or retained) with this version.
Since Version 8.3, EAGLE supports the association of 3D packages
with devices in libraries, schematics, and board files. Those 3D
packages will not be understood (or retained) with this version.